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BGA Lateral Microscope

Outstanding imaging quality enables fast and flexible inspection, measurement, and documentation of hidden solder joints in:BGA & µBGA、Flip Chip、CSP & CGA、SMD components.


Product Introduction

Product Overview


●     High-resolution 5.0MP USB3.0 digital microscope

●     Low-profile 90° optical probe for 40mm BGA standoff inspection

●     Interchangeable lenses: Side-view 90° lens + Top-view 8-80x zoom lens

●     Gooseneck-arm modular high-power LED illumination

●     Built-in 180° rotation mechanism for camera/probe positioning

●     Soft-touch adjustment system for precise camera/probe alignment

●     Precision XY stage with rapid-feed micrometer drive


Includes INSPECTIS© software suite: Image capture, utilities & metrology tools.



Scope of application

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