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BGA Lateral Microscope

Outstanding imaging quality enables fast and flexible inspection, measurement, and documentation of hidden solder joints in:BGA & µBGA、Flip Chip、CSP & CGA、SMD components.


Product Introduction


Product Overview


· High-resolution 5.0MP USB3.0 digital microscope

· Low-profile 90° optical probe for 40mm BGA standoff inspection

· Interchangeable lenses: Side-view 90° lens + Top-view 8-80x zoom lens

· Gooseneck-arm modular high-power LED illumination

· Built-in 180° rotation mechanism for camera/probe positioning

· Soft-touch adjustment system for precise camera/probe alignment

· Precision XY stage with rapid-feed micrometer drive


Includes INSPECTIS© software suite: Image capture, utilities & metrology tools.



Scope of application

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