BGA Lateral Microscope
Outstanding imaging quality enables fast and flexible inspection, measurement, and documentation of hidden solder joints in:BGA & µBGA、Flip Chip、CSP & CGA、SMD components.
Product Introduction
Product Overview
· High-resolution 5.0MP USB3.0 digital microscope
· Low-profile 90° optical probe for 40mm BGA standoff inspection
· Interchangeable lenses: Side-view 90° lens + Top-view 8-80x zoom lens
· Gooseneck-arm modular high-power LED illumination
· Built-in 180° rotation mechanism for camera/probe positioning
· Soft-touch adjustment system for precise camera/probe alignment
· Precision XY stage with rapid-feed micrometer drive
Includes INSPECTIS© software suite: Image capture, utilities & metrology tools.
Scope of application