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The Challenges in Solder Paste Management

2025-04-18 02:46:05 来源:普玛仕

    Solder paste management involves multiple aspects, including storage conditions, usage cycle, batch management, etc. Here are some methods to solve the challenges in solder paste management:


   (1) Solder paste has high requirements for the storage environment and needs to be stored under conditions of low temperature (2-10 degrees) and low humidity (relative humidity below 50%). Traditional manual management often makes it difficult to ensure the consistency of these conditions. To this end, using an intelligent storage cabinet with constant temperature and humidity functions is an effective solution. It can automatically adjust the temperature and humidity to ensure that each can of solder paste is stored under ideal conditions.


   (2) In order to ensure the quality of the solder paste, the usage cycle should be controlled, and the storage time should not exceed 6 months. Adopting the principle of first-in, first-out (FIFO) of the intelligent storage cabinet can help enterprises better manage the usage cycle of the solder paste, ensuring that the earlier batches of solder paste are used preferentially and reducing the risk of expiration.


   (3) In traditional solder paste management methods, the problem of batch confusion is likely to occur. The intelligent storage cabinet records the information of each batch through the automatic code scanning function and supports management according to the production date. This method reduces the possibility of batch confusion and is convenient for tracing the usage of each batch.



   (4) Real-time monitoring and data recording are crucial for solder paste management. The intelligent storage cabinet is equipped with a complete monitoring system, which can record temperature and humidity data in real time, provide detailed usage records, and facilitate the management level to understand the status and provide a basis for analysis.


   (5) Through these methods, enterprises can effectively solve the challenges in solder paste management and ensure the quality and reliability in the production process.


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